Semiconductor Innovation at Atomic Scale

Pioneering the future of microchip technology with breakthrough innovations in quantum computing and AI acceleration.

Revolutionary Products

Quantum Processor

Quantum Processor QX-9000

Next-generation quantum processing unit with 128 qubits

Technical Specifications

  • • 128 Quantum Bits
  • • 5nm Process Node
  • • 4.5 GHz Clock Speed
  • • Quantum Error Correction
  • • Neural Processing Unit
AI Accelerator

AI Accelerator Matrix-X

Dedicated neural processing architecture for AI workloads

Technical Specifications

  • • 256 TOPS Performance
  • • 7nm Process Node
  • • 16GB HBM2 Memory
  • • TensorFlow Optimized
  • • 15W TDP
Memory Module

Quantum Memory QM-1

Ultra-high bandwidth quantum memory solution

Technical Specifications

  • • 1TB/s Bandwidth
  • • Quantum State Storage
  • • 3D Stacked Design
  • • ECC Protection
  • • 8W Power Draw

Core Technologies

Quantum Architecture

Revolutionary quantum computing architecture enabling unprecedented processing capabilities for complex calculations.

Neural Processing

Advanced neural networks optimized for machine learning and AI applications with dedicated processing units.

Power Efficiency

Revolutionary power management system reducing energy consumption while maintaining peak performance.

Innovation Timeline

2023

Quantum Processor Launch

Successfully launched the world's first commercial 128-qubit quantum processor, revolutionizing the computing industry.

2022

AI Acceleration Breakthrough

Developed proprietary AI acceleration architecture achieving 400% performance improvement over traditional solutions.

2021

5nm Process Achievement

Successfully developed and implemented 5nm manufacturing process for high-performance computing chips.

Research Facilities

Clean Room

Advanced Clean Room

State-of-the-art ISO Class 1 clean room facility for semiconductor manufacturing

Research Lab

Quantum Research Lab

Cutting-edge research facility dedicated to quantum computing development

Chip Manufacturing Process

Silicon Wafer Preparation

Ultra-pure silicon ingot slicing and polishing with 99.999999% purity.

Wafer Size 300mm
Thickness 775μm

Photolithography

EUV lithography process for ultra-fine circuit patterns.

Resolution 5nm
Wavelength 13.5nm

Ion Implantation

Precision doping process for semiconductor properties.

Energy Range 0.2-80keV
Uniformity ±0.5%

Metallization

Multi-layer interconnect formation using copper damascene process.

Layers 15+
Line Width 20nm

Packaging

Advanced 3D packaging with through-silicon vias (TSV).

Package Type FCBGA
I/O Count 2000+

Performance Analytics

Global Shipment Metrics

Efficiency Comparison

Carbon Footprint Reduction

47%
vs. Industry Average

Power Efficiency

35%
Energy Savings

Production Yield

99.9%
Success Rate

Industry Applications

Automotive

Automotive

Advanced driver assistance systems powered by our neural processing units achieve 30% lower power consumption.

Data Centers

Data Centers

High-performance computing solutions delivering 4x throughput improvement for AI workloads.

IoT

IoT & Smart Cities

Ultra-low power IoT processors enabling 5+ years of battery life for smart city sensors.